Akasa Pro-grade+ 5026 heat sink compound 2.9 W/m·K 3 g

SKU

AK-TC5026

Skip to the end of the images gallery

Skip to the beginning of the images gallery

In Stock - Available On Backorder

2.9 W/mK, 100K cP, 3g

Category: Heat Sink Compounds

Details

Excellent thermal performance, even at lo-pressures.

When every degree matters, get more from your cooler. Pro-grade+ silicone-tech evolution 5026 provides ultra thin bond lines, hi-thermal conductivity and hi-temperature stability, creating the ultimate thermal compound. It’s suitable for all CPUs and applications, from fanless cases to hi-performance coolers.

More Information

SKU

AK-TC5026

Specification

Features
Constitutive ingredients	Silicone
Thermal resistance	0.03 °C/W
Thermal conductivity	2.9 W/m·K
Operating temperature (T-T)	-45 - 200 °C
Product colour	Grey
Specific gravity	3.23 g/cm³
Technical details
Compliance certificates	RoHS
Constitutive ingredients	Silicone
Thermal resistance	0.03 °C/W
Thermal conductivity	2.9 W/m·K
Operating temperature (T-T)	-45 - 200 °C
Weight & dimensions
Weight	3 g
Packaging data
Quantity per pack	1 pc(s)
Operational conditions
Operating temperature (T-T)	-45 - 200 °C
Colour
Product colour	Grey
Logistics data
Quantity per pack	1 pc(s)

Manufacturer

Akasa

Availability