AMD EPYC 7313 processor 3 GHz 128 MB L3 Tray

SKU

100-000000329

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In Stock - Available On Backorder

16 cores, 32 threads, 3GHz base clock, 3.7GHz boost clock, 128MB L3 cache, 155W TDP

AMD EPYC 7313 processor 3 GHz 128 MB L3 Tray is available to buy in increments of 1

Category: Processors

More Information

More Information
Processor socket	Socket SP3
Box	No
Processor cores	16
Processor family	AMD EPYC
SKU	100-000000329
EAN	8592978306618
Manufacturer	AMD
Availability	N
Product Family	EPYC

Description

Accelerate Workload Performance
Data centers that require the best CPU performance, security features, and scalability count on

Solution Briefs and White Papers
Find the technical resources you need to learn more about AMD EPYC™.

Where to Buy EPYC™️ Powered Solutions
Find a partner offering AMD EPYC™ Processors and solutions.

AMD Data Center Insights and Updates
Sign up to receive the latest data center news and server content.

AMD Infinity Guard
Help minimize potential attack surfaces as software is booted, executed, and processes your critical data

AMD Infinity Architecture
With architecture, performance, and security leadership, our approach to processor design accelerates the pace of innovation so that you can break through years of data center stagnation.

Specifications

Processor
Processor base frequency	3 GHz
Processor manufacturer	AMD
Cooler included	No
Configurable TDP-down	155 W
Thermal Design Power (TDP)	155 W
Processor cache	128 MB
Processor model	7313
Processor threads	32
Processor boost frequency	3.7 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	16
Processor socket	Socket SP3
Configurable TDP-up	180 W
Processor cache type	L3
Package type	Tray
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Configurable TDP-down	155 W
Thermal Design Power (TDP)	155 W

Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	155 W
Market segment	Server
Configurable TDP-up	180 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	155 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Processor special features
Configurable TDP-up	180 W
Packaging data
Package type	Tray
Logistics data
Harmonized System (HS) code	85423119

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SKU	100-000000329	S26361-F3828-L240	100-000000078	100-000000045	100-000000049	100-100000063WOF
Manufacturer	AMD	Fujitsu	AMD	AMD	AMD	AMD
Processor family	AMD EPYC	Intel Xeon E5 v2	AMD EPYC	AMD EPYC	AMD EPYC	AMD Ryzen 7
Discrete graphics card	N	N/A	N	N	N	N
Processor lithography	N/A	up to 22nm	up to 22nm	up to 22nm	up to 22nm	up to 22nm
Cooler included	N	N/A	N	N	N	N
On-board graphics card	N	N	N	N	N	N
Processor socket	Socket SP3	LGA 1356 (Socket B2)	Socket SP3	Socket SP3	Socket SP3	Socket AM4
Processor cores	16	4	16	32	16	8
Package type	Tray	N/A	Tray	Tray	Tray	Box